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working procedure
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project
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Process capability
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remarks
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classification
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routine
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special
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product
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Number of layers
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Floors 1-6
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Finished product shape
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±0.1mm
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±0.05mm
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Dimensional tolerance
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Minimum size of finished product
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5*5mm
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3*3mm
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FPC plate thickness
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Single panel: 0.08-0.13mm
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Minimum: 0.05mm
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Receiving orders outside the normal capacity
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Double sided plate: 0.10-0.25mm
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Minimum: 0.08mm
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Need review before
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Three layer plate: 0.20-0.25mm
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Minimum: 0.18mm
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Four layer plate: 0.25-0.30mm
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Minimum: 0.20mm
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FPC plate thickness tolerance
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Single and double-sided plate: ± 0.03mm
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Multilayer board: ± 0.05mm
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Gold finger area tolerance
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±0.03mm
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engineering
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Multilayer laminated structure
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Three layer board: 1 double and 1 single
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1 single
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Design
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Four layer board: 1 single, 1 double and 1 single;
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1 double 1 double / 1 single 1 single 1 single
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Minimum distance between line edge and forming edge
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0.2mm
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0.1mm
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To achieve 0.1mm, it needs to be made by laser or fine steel mold
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Mosaic size
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Length * width: within 250mm * 300mm
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Max. 250 * 500mm
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Beyond special abilities
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Process edge size
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Single panel: single side ≥ 7mm
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Unilateral ≥ 5mm
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Review before receiving orders
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Double sided plate: single side ≥ 7mm
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Unilateral ≥ 5mm
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Multilayer board: single side ≥ 12mm
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Unilateral ≥ 10mm
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drill hole
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Borehole diameter
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0.1-6.35mm
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Minimum aperture 0.07mm
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Slot hole diameter
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0.8mm*1.5mm
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0.5-1.0mm
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Bore tolerance
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PTH hole: ± 0.075mm
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Npth hole: ± 0.05mm
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Hole position accuracy
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Primary drilling: ± 0.075mm
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Secondary drilling: ± 0.1mm
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copper plating
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Hole copper thickness
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Double sided board: 8-15um
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According to customer requirements
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Beyond special abilities
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Multilayer board: 12-18um
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According to customer requirements
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Review before receiving orders
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line
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Ring edge of hole ring
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Double sided plate: 0.125mm
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0.1mm
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Outer layer of multilayer board: ≥ 0.125mm
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0.1mm
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Inner layer of multilayer board: ≥ 0.15mm
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0.1mm
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PTH hole rim
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Double sided plate: ≥ 0.1mm
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Pad to line distance
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Outer layer of multilayer board: ≥ 0.1mm
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0.05mm
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Inner layer of multilayer board: ≥ 0.15mm
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0.1mm
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Npth hole cutting copper
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≥0.2mm
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Grid size
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0.4mm * 0.4mm, 45 ° tilt
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Film compensation
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1 / 3oz bottom copper: 0.02mm
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1 / 2oz bottom copper: 0.025mm
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1oz bottom copper: 0.035mm
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For the independent line, 0.15mm shall be added on the basis of overall compensation
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Minimum line width and line spacing
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1 / 2oz bottom copper: 0.05mm
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1oz bottom copper: 0.10mm
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Line alignment
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±0.075mm
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Line coincidence
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±0.075mm
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Etching tolerance
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±0.02mm
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Fit
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Covering film window opening hole
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Drilling: 0.3mm
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Minimum square window covering film
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Borehole: 0.7mm
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Minimum window spacing of covering film
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Drilling: 0.5mm
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0.3mm
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Glue overflow of covering film
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≤0.15mm
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Coating alignment
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≤0.2mm
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≤0.1mm
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printing
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Resistance welding window from pad
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0.10mm
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Unilateral minimum distance
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0.2mm
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Minimum resistance bridge
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0.25mm
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Resistance welding thickness
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10-25um
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Minimum character line width
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≥0.13mm
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Minimum character line height
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≥0.80mm
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Minimum distance from character to pad
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0.30mm
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surface treatment
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Thickness of gold and nickel
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0.025um-0.075um/1-3um
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Gold and nickel plating thickness
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0.025um-0.075um/1-3um
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0.1~0.25um
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